Die Bonding (Chip Mounter)

Product used: LCA8 series linear actuator with vacuum

8mm pitch air cylinders were used for chip mounting. Due to poor force control, air cylinders break parts or leave a mark on parts during the pick-up motion.

With SMAC Soft-Land™ function and controlled low contact force during Pick and Place procedure, the machine doesn’t break or mark on the die which improved thought out-put. With the same width, 8mm, customer was easily able to upgrade their existing machine without modification.